Samsung and TSMC Commit to ASML High NA EUV Tools

Samsung and TSMC have committed to adopting ASML’s High NA extreme ultraviolet lithography machines for advanced chip production. Samsung plans to deploy the technology for DRAM manufacturing by 2028, while TSMC aims to integrate it into high-volume advanced node production starting in 2030.

The companies also joined an industry initiative to transition from 6-inch to 12-inch photomasks. This effort targets a pilot line by 2031, with full production readiness expected by 2033.